Quazer® 3

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LASER SAWING & SHAPING FOR BEST VALUE DIAMOND PROCESSING

Quazer®是一个先进优质的绿色激光钻石切割系统，集高生产力和盈利能力、低断裂风险和灵活切割特点于一体。

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Key Benefits

  • Minimal breakage
  • Low weight loss due to green laser technology and double-sided sawing cassette
  • Smooth cutting surface achieved by application of green laser technology and high quality motion system
  • 16W high power green diode laser affords high productivity and shorter processing time
  • Stone protection software reduces risk of stone damage
  • Large working area allows processing of numerous stones in a single batch
  • Advanced and user-friendly software interface allows easy and effective operation
  • Pie-cut sawing supported while using Sarine Strategist®
  • Advanced shaping and cutting functionalities available as add-ons
  • High durability and low maintenance costs

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Technical Specifications

  • Wave Length
    532 nm
  • Dimensions
    L: 1.60m (5’ 3”); W:1.18m (3’10”); H:1.80m (5’11”)
  • Weight
    ~400 kg (882 lbs)
  • Electricity
    Voltage 230VAC, Current 12Amp, Frequency 50/60Hz
  • Power Consumption
    less than 3000 VA
  • Laser source
    Nd:YAG
  • Axis travel
    330mm x 278mm x 62mm

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